Unicorn Electronics' Manufacturing Capabilities
Unicorn has 2 state-of-the art automated LCD manufacturing lines capable of making 7M pcs of passive LCD panels. For every LCD panel, Unicorn can offer a wide range of module design and manufacturing technologies , they are:
- Fine pitch Chip on Glass (COG) bonding.
- COF ILB (Inner Lead Bonding) for bonding chips on foil.
- Fine pitch Flex on Glass (FOG) for bonding HSC/TAB/COF/FPC onto LCD glass.
- Surface Mount Technology (SMT) for PCBA/FPCA assemblies.
- Automated Optical Inspection (AOI) for display inspection.
- Optical bonding with OCR (optical clear resin) technology.
- Test Engineering with in-house testing software and hardware development.
- Complete module assembly and testing.