Unicorn Electronics' Manufacturing Capabilities

Unicorn has 2 state-of-the art automated LCD manufacturing lines capable of making 7M pcs of passive LCD panels. For every LCD panel, Unicorn can offer a wide range of module design and manufacturing technologies , they are:

  • Fine pitch Chip on Glass (COG) bonding.
  • COF ILB (Inner Lead Bonding) for bonding chips on foil.
  • Fine pitch Flex on Glass (FOG) for bonding HSC/TAB/COF/FPC onto LCD glass.
  • Surface Mount Technology (SMT) for PCBA/FPCA assemblies.
  • Automated Optical Inspection (AOI) for display inspection.
  • Optical bonding with OCR (optical clear resin) technology.
  • Test Engineering with in-house testing software and hardware development.
  • Complete module assembly and testing.