Unicorn Electronics' Manufacturing Capabilities

Unicorn has 2 state-of-the art automated LCD manufacturing lines capable of making 7M pcs of passive LCD panels. For every LCD panel, Unicorn can offer a wide range of module design and manufacturing technologies , they are:

• Fine pitch Chip on Glass (COG) bonding.
• COF ILB (Inner Lead Bonding) for bonding chips on foil.
• Fine pitch Flex on Glass (FOG) for bonding HSC/TAB/COF/FPC onto LCD glass.
• Surface Mount Technology (SMT) for PCBA/FPCA assemblies.
• Automated Optical Inspection (AOI) for display inspection.
• Optical bonding with OCR (optical clear resin) technology.
• Test Engineering with in-house testing software and hardware development.
• Complete module assembly and testing.